Particle Deposition System to calibrate SSIS and Wafer Inspection Systems, Nano Particle Technology, KLA-Tencor SP1, KLA-Tencor SP2, Tencor 6420

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Applied Physics, Inc.

Applied Physics, Inc. supports

MSP Corporation Products

Particle Deposition System, Particle Wafer Standards

particle deposition systemParticle Deposition System - Request a Quote

PSL Wafer Standard, Particle Wafer Standard, Size Calibration Wafer for size calibration of KLA-Tencor Surfscan SP1, KLA-Tencor Surfscan SP2, KLA-Tencor Surfscan SP3, KLA-Tencor Surfscan SP5, Surfscan 6420, Surfscan 6220, Surfscan 6200, ADE, Hitachi and Topcon SSIS tools and wafer inspection systems. - The 2300 XP1 can deposit on 150mm, 200mm and 300mm wafers using PSL Spheres, SiO2 particles; as well as a variety of particles such as Silicon Nitride (Si3N4), Titanium Oxide (TiO2), Tungsten (W), Copper (CU) and Tantalum (Ta) metals.

  • 20nm to 1um PSL and Particle Wafer Deposition (see image below of 22.37nm deposition)
  • Optional 2nd year warranty, Preventive Maintenance programs

particle calibration wafer, peak size accuracy

Details - Request a Quote

These particle deposition systems feature the most advanced particle atomization, electrostatic classification and deposition technology for creating highly accurate PSL Wafer Standards to calibrate KLA-Tencor, Applied Materials, TopCon, Hitachi, and ADE wafer inspection systems. They can also deposit process particles on wafers to create WET Bench Particle Standards to challenge the cleaning efficiency of WET Clean benches.

Cleaning efficiency improvements of 3.0% to 10% are achievable for cleaning systems with these advanced particle deposition tools creating a superb ROI. Uniform sized process particles of SiO2, Al2O3, TiO2, Si3N4, Si, Ti, W, Ta, Cu, etc. can be deposited on wafers to provide particle on wafer adhesion so wafer cleaning tools can be realistically evaluated.

The 2300 NPT-2 features fully automatic operation in support of 200mm Bridge requirements and 300mm FOUP requirements. The NPT-2 is designed to support both Metrology Size Response calibration of Wafer inspection systems; as well as Wet Bench applications with hands-off, fully automatic operation.

2300 NPT-2 Features & Applications - Request a Quote

  • High resolution, NIST (National Institute of Standards and Technology) traceable DMA sizing and classification exceed the new SEMI Standards M52, M53 and M58 protocol for PSL size accuracy and size distribution width.
  • Automatic size calibration using NIST 60.4nm SRM, as well as 100.8nm, 269nm and 895nm NIST SRMs
  • NPT, Nano Particle Calibration removes the background haze particles, which cause a significant size shift is traditional DMA based PSL depositions. MSP is the only company providing this new capability, TRUE SIZE CALIBRATION to its customer base
  • Advanced Differential Mobility Analyzer (DMA) technology featuring automatic temperature and pressure compensation for improved system stability and measurement accuracy.
  • Calendar PM alerts to flat-panel display (FPD) to remind operator that maintenance is required.
  • User-friendly recipe-controlled software
  • Automatic deposition process provides multiple depositions on one or a full cassette of wafers, followed by self-clean and purge.
  • Automatic nozzle positioning and wafer rotation allows a variety of deposition shapes to be created: multiple spot, ring-shaped, full-wafer deposition, and other custom-shapes.
  • Automatic wafer handling provides fast, hands-free, computer handling for 300 mm and optional 200 mm wafers.
  • CE Mark, SEMI S2, S8, S14 compliant, SEMI M52, SEMI M53 and SEMI M58 Standards compliance
  • Full Wafer Depositions, Spot and Ring Wafer Depositions at any location on the wafer.
  • Twelve particle sources for effective and rapid deposition of up to 50 different PSL sizes or process particle sizes
  • High sensitivity permitting PSL sphere and process particle deposition from 20nm to 1um, or optionally
  • Deposit process particle on wafers to provide realistic adhesion between particle and wafer surface for cleaning process development and cleaning system improvement to increase efficiency and through-put.
  • Deposit PSL spheres on wafers to create calibration standards for KLA-Tencor, Applied Materials, Topcon, Hitachi, and ADE wafer inspection systems.
  • Full Depositions, Spot Depositions, Arc Depositions and Ring Depositions

Deposit PSL spheres and process particles on bare, film-layered, and patterned wafer to study influence of wafer surface. Deposit process particles on the surface and EDGE to study particle migration and WET Clean particle migration in support of particle reduction programs.

Model 2300 NPT-1 - Request a Quote

MODEL 2300 NPT-1 supports all 200mm and 300mm Metrology applications using manual wafer loading to produce PSL Wafer Standards to calibrate the size response curves of tools such as KLA-Tencor SP1, SP2, SPX �wafer inspection systems; as well as Topcon, Hitachi, ADE and AMAT Wafer Inspection Systems. The 2300 NPT-1 system provides Residue free, true calibration sizes on PSL sphere and Process Particle Depositions. Email John Turner for more details on the 2300 NPT-1.
  • Standard 20nm to 1um PSL and Particle Wafer Deposition
  • Standard Manual wafer loading on PEEK wafer contact pins
  • Optional 2nd year warranty, Preventive Maintenance programs

MODEL 2300 XP1 - Request a Quote

MODEL 2300 XP1 supports KLA-Tencor 6200 series, 6400 series, SP1-TBI, older TopCon, Hitachi and ADE Wafer Inspection Systems.
  • Standard 80nm to 1um PSL and Particle Wafer Deposition, manual load for 150mm, 200mm, 300mm;
  • Optional 50nm lower sensitivity, 2nd year warranty, Preventive Maintenance programs