Semiconductor, Aerosol & Pharmaceutical Metrology Products for Asia, Europe, Canada, USA, Central & South America

Applied Physics, Inc.

Clean Room Fogger, CRF4

Ultrapure Nitrogen Fogger, AP35

REQUEST A QUOTE

Calibration Wafer Standards

PSL Wafer Standard

Contamination Wafer Standards

Particle Wafer Standards

Cleanroom Fogger, CRF2

LN2 Nitrogen Fogger

PSL Spheres, Polystyrene Latex Beads

Silica Nanoparticles in 15ml Di Water

Hydrophobic Silica

Functionalized Silica

Smoke Studies to Visualize Airflow and Turbulence

Call Applied Physics, Inc.

1-720-635-3931 or 303-999-6837


Particle Deposition and PSL Depostions Systems

MODEL 2300 XP1 - Request a Quote

MODEL 2300 XP1 supports KLA-Tencor SP1-TBI & SP2-TBI, TopCon, Hitachi and ADE Wafer Inspection Systems.
  • Standard 80nm to 1um PSL and Particle Wafer Deposition, manual load for 150mm, 200mm, 300mm;


  • Optional 30nm lower sensitivity, 2nd year warranty, Preventive Maintenance programs




MODEL 2300 XP2 - Request a Quote

MODEL 2300 XP2 supports all 200mm Open Cassette applications for wafer inspection systems and Wet Bench applications
  • Standard 30nm to 1um PSL and Particle Wafer Deposition


  • Optional 2nd year warranty, Preventive Maintenance programs







MODEL 2300 XP3 - Request a Quote

MODEL 2300 XP3 supports all 300mm FOUP applications for wafer inspection systems and Wet Bench applications
  • 30nm to 1um PSL and Particle Wafer Deposition


  • Optional 2nd year warranty, Preventive Maintenance programs








Particle Wafer Deposition SystemDETAILS - Request a Quote

These high performance, particle deposition systems feature the most advanced particle atomization, electrostatic classification, and deposition technology for creating highly accurate PSL (polystyrene latex size standards for calibrating KLA-Tencor, Applied Materials, TopCon, Hitachi, and ADE wafer inspection systems.

They can also deposit mono-dispersed process particles on wafers to create WET Bench Particle Standards to challenge the cleaning efficiency of WET Clean benches.

Cleaning efficiency improvements of 3.0% to 10% are achievable for cleaning systems with these advanced particle deposition tools creating a superb ROI. Uniform sized process particles of SiO2, Al2O3, TiO2, Si3N4, Si, Ti, W, Ta, Cu, etc. can be deposited on wafers to provide particle on wafer adhesion so wafer cleaning tools can be realistically evaluated.

Both the 2300 XP1 and XP2 systems feature recipe control and automatic multi-spot and multi-size deposition.

Wafer loading and unloading is manual with the XP1.

The XP2 features fully automatic operation from 200mm open cassette. The 2300 XP3 is devoted to 300mm FOUP applications in support of metrology and Wet Bench applications with hands-off, fully automatic operation.




FEATURES & APPLICATIONS - Request a Quote

  • High resolution, NIST (National Institute of Standards and Technology) traceable DMA sizing and classification exceed the new SEMI Standards M53 protocol for PSL size accuracy and size distribution width.

  • Advanced Differential Mobility Analyzer (DMA) technology featuring automatic temperature and pressure compensation for improved system stability and measurement accuracy.

  • Calendar PM alerts to flat-panel display (FPD) to remind operator that maintenance is required.

  • User-friendly recipe-controlled software

  • Automatic deposition process provides multiple-spot deposition on one wafer, followed by self-clean and purge.

  • Automatic nozzle positioning and wafer rotation allows a variety of deposition shapes to be created: multiple spot, ring-shaped, full-wafer deposition, and other custom-shapes.

  • Automatic wafer handling provides fast, hands-free, computer handling for 200 mm and 300 mm wafers.

  • CE Mark, SEMI S2, S8, S14 compliant, SEMI M52 standards compliant

  • Full Wafer Depositions and Spot Wafer Depositions at any location on the wafer.

  • Four sonicating atomizers keep PSL spheres and process particles suspended in solution for effective and rapid deposition of up to 8 different PSL sizes and four different process particle materials in a single setup

  • High sensitivity permitting PSL sphere and process particle deposition from 80nm to 1um, optionally from 30nm to 2um or 20nm to 2um.

  • Deposit process particle on wafers to provide realistic adhesion between particle and wafer surface for cleaning process development and

    cleaning system improvement to increase efficiency and through-put.

  • Deposit PSL spheres on wafers to create calibration standards for KLA-Tencor, Applied Materials, TopCon, Hitachi, and ADE wafer inspection systems.

  • Deposit PSL spheres and process particles on bare, film-layered, and patterned wafer to study influence of wafer surface, and particle refractive index on optical response of wafer inspection systems.


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